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grinding roots in clay cu zn pb equipment

grinding roots in clay cu zn pb equipment

SiC particles, particularly with the finer size papers, embed easily whengrindingsoft metals, such asPb, Sn, Cd and Bi (see Figure 3.1). Embedding of diamond abrasive is also a problem with these soft metals and with aluminum, but mainly with slurries when napless cloths are used, see Figure 3.2.

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