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grinding machine for thinner material

grinding machine for thinner material

We use fully-automated Disco and Strasbaugh wafer backgrinding equipment to achieve the highest possible level of quality and can continuously achieve thin wafer target thicknesses to less than 0.050mm (0.002”). Achieving these ultra-thin thicknesses requires a grindwheel with extremely fine diamond grit.

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Hi,may I help you with products, price, etc?